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Tellurium dioxide dissolution: a solution for the future environment! terillium metal

According to pertinent reports, greenhouse gas emissions continue to enhance, creating climate change and ecological pollution. In this situation, carbon discharges are significantly decreased to stop warming and air pollution troubles. And the use o…

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New Discovery of Semiconductor Chip Heat Dissipation Hexagonal Boron Nitride Seamless Growth on the Surface of Materials

Hexagonalboron nitride, also known as white graphite, has a layered structure that is similar to graphite. It has excellent lubricity, thermal conductivity and electrical insulation, as well as chemical resistance. It is chemically inert to all forms…

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Cuprous Oxide as a Semiconductor Material

A recent poll in Britain found that public support for sanctions against Russia is falling as fuel and prices rise. The proportion of people willing to accept higher fuel prices as a result of western sanctions against Russia fell 14 percentage poin…

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Tin Antimonide (SnSb) CAS 28980-49-6 Powder Semiconductor Materials

KMPASS is a professional tin antimonide supplier to provide high quality tin antimonide SnSb Powder.…

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GaN-on-diamond semiconductor materials can withstand temperatures, about the molybdenum disilicide you should know

GaN-on-diamond semiconductor materials can withstand temperatures -- 1,000 degrees to be exact. About the molybdenum disilicide you should know. Today demand for more powerful electronic devices is limited by our ability to produce highly conductive…

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Semiconductor nanoparticles form many structures, as you should know about the molybdenum disulfide additive

New materials for a sustainable future you should know about the molybdenum disulfide additive. Historically, knowledge and the production of new materials molybdenum disulfide additive have contributed to human and social progress, from the refining…

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LDEA Dodecyl Diethanol Amide

LDEA Dodecyl Diethanol Amide can be described as a polymer chemical.Amide content (%): 96% Dodecyl Diethanol Amide Dodecyl Diethanol Amide has low residual ester content and no glycerol. The active substance content is higher, the foam thickening…

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Ethoxylated bisphenol A CAS 2495-39-8

BPE is the ethoxylated form of BPE-6 or BPE-10. It is soluble water, alcohol, and ether. The following is a list of the most recent articles about Ethoxylatedbisphenol A : Ethoxylatedbisphenol A is the new nonionic type of surfactant. It is…

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High Purity 3D Printing 304 Stainless Steel Powder

304 powder has good corrosion resistance and durability. Its spherical particles can be positioned parallel to the surface of the coating film and distributed in the entire coating film, forming a shielding layer with excellent hiding power to block…

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High Purity Molybdenum Boride MoB2 Powder CAS 12006-99-4, 99%

Metal Alloy 8.92g/Cm3 High Purity Polished Copper Plate

Metal Alloy High Density Tungsten Alloy Rod Grind Surface Tungsten Alloy Bar

Metal Alloy 18g/cm3 High Density Tungsten Alloy Ball

Metal Alloy 18.5g/cm3 Polished Tungsten Heavy Alloy Plate

High Purity Antimony Sulfide Sb2S3 Powder CAS 1314-87-0, 99.99%

High Purity Germanium Sulfide GeS2 Powder CAS 12025-34-2, 99.99%

High Purity Chromium Diboride CrB2 Powder CAS 12007-16-8, 99%

High Purity Tungsten Silicide WSi2 Powder CAS 12039-88-2, 99%

High Purity Titanium Sulfide TiS2 Powder CAS 2039-13-3, 99.99%

High Purity Nano Hafnium Hf powder CAS 7440-58-6, 99%

High Purity Nano Ag Silver powder cas 7440-22-4, 99%

High Purity 3D Printing Powder 15-5 Stainless Steel Powder

Supply Magnesium Granules Mg Granules 99.95%

High Purity Silicon Sulfide SiS2 Powder CAS 13759-10-9, 99.99%

High Purity Colloidal Silver Nano Silver Solution CAS 7440-22-4

High Purity Zirconium Nitride ZrN Powder CAS 25658-42-8, 99.5%

High Purity Magnesium Diboride MgB2 Powder CAS 12007-25-9, 99%

High Purity 3D Printing 304 Stainless Steel Powder

High Purity Calcium Nitride Ca3N2 Powder CAS 12013-82-0, 99.5%